Job Description

Roles and Responsibilities

• Design complex avionics systems, integrating both digital and analog components.
• Support activities for new bids and proposals, contributing to our growth and innovation.
• Stay abreast of technology trends and advancements in embedded systems and electronic components.
• Design processor and FPGA assemblies, including schematic capture, component placement, layout constraints, PWB stack-up, and layout review/approval.
• Conduct board bring-up, integration, and verification activities to ensure robust performance.
• Troubleshoot complex issues involving processors, FPGAs, and memory components.
• Apply Design for Manufacturing (DFM), Maintainability, and Testability principles to enhance product quality.
• Participate in architectural trade studies and proposal development to drive strategic decisions.
• Interface with customers independently, providing expert guidance and support.
• Mentor junior engineers, fostering their growth and development.
• Lead and coordinate multi-disciplinary design teams, ensuring cohesive and effective collaboration.
• Propose and implement improvements in internal processes to drive efficiency and innovation.

Required Qualifications

• Bachelor’s degree in Electrical Engineering or related field.
• Proven experience in board-level digital design, including schematic design, implementation, integration, and verification.
• Expertise in designing high-speed interfaces.
• Proficiency in Board Level Timing Analysis, Stress  and Derate Analysis, Signal Integrity & Power Integrity.
• Strong problem-solving skills with the ability to break down complex issues and apply critical thinking.
• Exceptional technical writing and communication skills.
• Experience mentoring and sharing expertise with junior engineers.

Desired Characteristics

• Master’s degree in Electrical Engineering with 10+ years of professional experience in digital design.
• Proven track record of architecting complex digital hardware systems.
• In-depth knowledge of the board-level digital design process, from schematic capture to implementation, integration, and verification.
• Expertise in laying out complex Printed Wiring Boards (PWBs).
• Experience designing with high-speed components such as Gigahertz microprocessors, FPGA, CPLD, DDR3 to DDR5 memory, flash memory, Gigabit Ethernet, and PCIe.
• Proficiency in working with large pin count devices, featuring 1000+ pins with 0.8mm device pitch or smaller.
• Skilled in High Density Interconnect (HDI) technologies, including micro vias, buried/blind vias, and back drilling for IPC Class 3 boards.
• Experience in designing high-speed serial links of 5+ Gbps, such as 10GBASE-KR, PCIe Gen3, and Fiber Optics.
• Familiarity with communication protocols like CAN, MIL-STD-1553, ARINC 429, ARINC 664, and TSN.
• Knowledge of OpenVPX and PICMG standards.
• Extensive experience in the Military, Aerospace, or Avionics sectors.
• Proficient with Mentor Graphics Expedition Enterprise and HyperLynx PI/SI tools.
• Familiarity with OrCAD PSPICE or LT Spice, Mathcad, Microsoft Office, and Microsoft Visio.
• Strong technical writing and communication skills.
• Ability to break down complex problems and apply critical thinking to develop effective solutions.​ 

Additional Job Description

Additional Information

Compensation Grade

LPB1

Relocation Assistance Provided: No